Materials Physics and Chemistry


Online-Issn No :
2661-412X
Print-Issn No :
XXXX
Language :
English
Publisher :
PiscoMed Publishing

Indexed - 2019 : IPI Value (2.06)

Indexed - 2020 : IPI Value (2.06)

Indexed - 2021 : IPI Value (2.52)


The Progress of Composites with High Thermal Conductivity and Electromagnetic Shielding


Article PDF :

Veiw Full Text PDF

Article type :

Original article

Author :

Houbao Liu,Renli Fu, Weisong Dong,Yingjie Song,Hao Zhang

Volume :

1

Issue :

4

Abstract :

As electronic components develop toward high power, high package density, and device size miniaturization, heat dissipation and electromagnetic interference between electronic components are becoming more and more serious. In order to solve the adverse elec tromagnetic waves and heat radiation generated by electronic devices, people have high hopes for electronic packaging materials with high thermal conductivity and electromagnetic interference resistance. This paper summa rizes the research status of high thermal conductivity composite materials and electromagnetic shielding composite materials. Finally, the latest research results of high thermal conductivity and electromagnetic shielding composites are introduced, and the future development trend of new materials for microelectronic packaging is prospected.

Keyword :

Composite Materials; High Thermal Conductivity; Electromagnetic Shielding

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