As electronic components develop toward high power, high package density, and device size miniaturization,
heat dissipation and electromagnetic interference between electronic components are becoming more and more
serious. In order to solve the adverse elec tromagnetic waves and heat radiation generated by electronic devices,
people have high hopes for electronic packaging materials with high thermal conductivity and electromagnetic
interference resistance. This paper summa rizes the research status of high thermal conductivity composite materials and electromagnetic shielding composite materials. Finally, the latest research results of high thermal conductivity and electromagnetic shielding composites are introduced, and the future development trend of new materials for microelectronic packaging is prospected.
Composite Materials; High Thermal Conductivity; Electromagnetic Shielding